Performance Heats Up with Cool Modules

Computer modules offer a simpler route for implementing the latest processor technology, rather than having to design a whole board. Typically, the carrier board is significantly easier to design. It can also be more cost-efficient since the carrier board often has fewer layers. Of course, pushing the performance envelope generally means dissipating a bit more heat. This is where cold plates, heatsinks, and heat pipes come into play. Incorporating cold plates into modules not only helps with heat issues—it also simplifies mechanical design chores. Cool, fanless solutions come in many forms. For instance, VersaLogic’s Hawk (Fig. 1) is a multi-board solution that puts the cold plate at the bottom of the stack, where it can be easily mounted on a metal case to help dissipate the heat. The Hawk runs…


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